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Chin. Opt. Lett.
 Home  List of Issues    Issue 11 , Vol. 16 , 2018    10.3788/COL201816.111202

Measurement of out-of-plane deformation of curved objects with digital speckle pattern interferometry
Pengfei Li, Ping Cai, Jun Long, Chiyue Liu, and Hao Yan
Department of Instrument, School of Electronic Information and Electrical Engineering, [Shanghai Jiao Tong University], Shanghai 200240, China

Chin. Opt. Lett., 2018, 16(11): pp.111202

Topic:Instrumentation, measurement and metrology
Keywords(OCIS Code): 120.4570  120.3940  

Digital speckle pattern interferometry (DSPI) is a high-precision deformation measurement technique for planar objects. However, for curved objects, the three-dimensional (3D) shape information is needed in order to obtain correct deformation measurement in DSPI. Thus, combined shape and deformation measurement techniques of DSPI have been proposed. However, the current techniques are either complex in setup or complicated in operation. Furthermore, the operations of some techniques are too slow for real-time measurement. In this work, we propose a DSPI technique for both 3D shape and out-of-plane deformation measurement. Compared with current techniques, the proposed technique is simple in both setup and operation and is capable of fast deformation measurement. Theoretical analysis and experiments are performed. For a cylinder surface with an arch height of 9 mm, the error of out-of-plane deformation measurement is less than 0.15 μm. The effectiveness of the proposed scheme is verified.

Copyright: © 2003-2012 . This is an open-access article distributed under the terms of the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original author and source are credited.

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Posted online:2018/10/30

Get Citation: Pengfei Li, Ping Cai, Jun Long, Chiyue Liu, and Hao Yan, "Measurement of out-of-plane deformation of curved objects with digital speckle pattern interferometry," Chin. Opt. Lett. 16(11), 111202(2018)

Note: This work was supported by the National Key Research and Development Project of China (No. 2016YFF0200700) and the National Natural Science Foundation of China (No. 61405111).


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