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Chin. Opt. Lett.
 Home  List of Issues    Issue 10 , Vol. 16 , 2018    10.3788/COL201816.101402


Thermal process of silica glass microchannels fabricated by femtosecond laser ablation
Xiaoyan Sun, Dongmei Cui, Youwang Hu, Dongkai Chu, Guowei Chen, Jinlong Yu, Jianhang Zhou, and Ji’an Duan
State Key Laboratory of High Performance Complex Manufacturing, College of Mechanical and Electrical Engineering, [Central South University], Changsha 410083, China

Chin. Opt. Lett., 2018, 16(10): pp.101402

DOI:10.3788/COL201816.101402
Topic:Lasers and laser optics
Keywords(OCIS Code): 140.3390  230.7380  240.6700  

Abstract
In order to improve the morphology of microchannels fabricated by femtosecond laser ablation, the thermal process was introduced into the post-treatment processing. It was found that the thermal process cannot only decrease the roughness but also the width and depth of the microchannel. The change rates of width, depth, and roughness of the microchannel increase with processing temperature. When we prolong the time of constant temperature, the change rate of the width decreases at the beginning, and then it tends to be stable. However, the change rates of depth and roughness increase, and then they tend to be stable. In this Letter, we discuss the reasons of the above phenomena.

Copyright: © 2003-2012 . This is an open-access article distributed under the terms of the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original author and source are credited.

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Received:2018/6/5
Accepted:2018/8/30
Posted online:2018/9/21

Get Citation: Xiaoyan Sun, Dongmei Cui, Youwang Hu, Dongkai Chu, Guowei Chen, Jinlong Yu, Jianhang Zhou, and Ji’an Duan, "Thermal process of silica glass microchannels fabricated by femtosecond laser ablation," Chin. Opt. Lett. 16(10), 101402(2018)

Note: This work was supported by the National Natural Science Foundation of China (Nos. 51875584, 51475482, 51475481, and 51875585) and the National Key R&D Program of China (Nos. 2018YFB1107803 and 2017YFB1104800).



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